Say goodbye to the pain of no

Release date：2016-09-01   Views：2018

Say goodbye to the pain of no "core" after the initial construction of "China core" industrial chain

[guide] in the industrial upgrading and economic restructuring of emerging markets represented by China, the importance of integrated circuit industry is self-evident. However, the reality is that the import volume of this kind of products alone exceeds the sum of iron ore, steel, copper and grain. Recently, the reporter has learned that in the face of "no core"

In the industrial upgrading and economic restructuring of emerging markets represented by China, the importance of integrated circuit industry is self-evident. However, the reality is that the import volume of this kind of products alone exceeds the sum of iron ore, steel, copper and grain.

Recently, the reporter learned that in the face of the pain of "no core", the national policy and financial support have been continuous in recent years, and the national teams including China Electronics Technology Group Corporation (hereinafter referred to as "CETC") are "taking the lead" in seizing the commanding heights of science and technology. At present, the construction of China's integrated circuit industry chain has been initially completed, but there are still disadvantages such as small scale and short board manufacturing, and the localization faces technical and market barriers. Industry insiders believe that in the new stage, China's IC industry will take a new path of original innovation and integrated innovation, and the internal integration speed of the industry is accelerating, and it will face a round of reshuffle.

"The United States once imposed export restrictions on ZTE on the ground of violating the export restriction law. The core hard injury is the pain of China's lack of" core ". Today is ZTE, and who is tomorrow? "Liu Gang, deputy general manager of Guorui Zhongshu Technology Co., Ltd., a subsidiary of Guorui group of 14 research institutes of CETC, sighed.

The worry of "being controlled by others" is far more than that, but also a series of risks, such as information security, delivery risk, production change, loss of profits, etc. According to China's customs import data, China's chip import volume has been rising from US $95.5 billion in 2007 to US $230.7 billion in 2015, which is 1.7 times of the total import of crude oil, and even exceeds the sum of four strategic materials, namely iron ore, steel, copper and grain. High value products such as computer processors and embedded chips in automobiles are completely dependent on imports.

The dual needs of market and national security make the development of "China core" increasingly urgent. As early as 2010, the State Council listed the new generation of information technology as one of the seven strategic emerging industries to speed up the cultivation and development. In 2014, the State Council issued the outline for promoting the development of the national integrated circuit industry. The goal is to gradually narrow the gap with the international advanced level by 2020, and the average annual growth rate of the industry's sales revenue will exceed 20%. By 2030, the main links of the industrial chain will reach the international advanced level and achieve leapfrog development.

One of the safeguard measures is to set up a national IC industry investment fund with a total scale of nearly 140 billion yuan, and encourage local funds to participate. Such ambition and investment are unprecedented. According to Morgan Stanley, China invested less than $1 billion in this field in the second half of the 1990s.

As a strategic team controlled by the state, the central enterprises have become the main force in this "battle against difficulties". CETC, which was established in 2002, is one of the pioneers. Focusing on security and intelligence, this military industry group focuses on developing strategic, overall and driving core technologies. Its 14 subordinate companies are known as the birthplace of China's radar industry. Driven by demand, Guorui group has set up two chip design companies, whose R & D scope covers DSP processor, SoC design, microcontroller and other digital chips as well as wireless communication and optical Communication, high performance ASIC and other analog chips.

China's first high-end chip with independent intellectual property rights - "Huarui No. 1" was born here. In 2011, it took the lead to pass the "nuclear high base" major special acceptance, representing the highest level of China's independent controllable embedded high-end DPS at that time. Its processing performance was equivalent to that of foreign similar DSP processors, breaking the foreign monopoly, and successfully realizing the independent, safe, efficient and controllable signal processing of national defense core equipment. At present, it has been applied in a large number of equipment.

"Since 2012, we have continued to undertake the research and development of Huarui No.2 DSP chip. At present, we have completed the in-house test, and are expected to complete and market this year." Liu Gang disclosed to reporters that "Huarui No.2" has inherited the "Huarui No.1" chip technology which has been successfully developed, and has adopted advanced technologies such as heterogeneous, 8-core, reconfigurable processing core, ultra-low-power design, and greatly improved the high-speed IO performance, integration and comprehensive processing capacity of the chip.

The development of CETC in the field of analog chip is also strong. It is understood that mg2000, which is applied to optical communication, was designed, developed and mass produced in 2014. In recent years, the sales volume of this chip has increased rapidly. The main customer is Huawei, which is expected to occupy 50% of the market share in 2016. The mg1015 + mg1021, which was released in 2015, is mainly used in communication base stations. At present, it has passed the test in ZTE and will be supplied in bulk for ZTE and Huawei in the future.

"China has initially completed the construction of integrated circuit industry chain, and a number of enterprises have begun to stand out." Ye Tianchun, director of the Institute of microelectronics, Chinese Academy of Sciences, said that at present, packaging technology has moved from low-end to high-end, reaching the international advanced level; key equipment and materials have been realized from scratch, some products have entered 14nm R & D, and manufacturing technology has made great progress, 28nm has entered mass production, 14nm R & D has made a breakthrough; the gap between system level chip design capability and international advanced level has been greatly narrowed.

However, what can not be ignored is that to achieve the new goal put forward by the Ministry of industry and information technology of the people's Republic of China on "2015 industrial base strengthening special action plan": it is obviously a heavy task and a long way to go to achieve 70% chip independent guarantee within 10 years and partially reach the international leading level.

In Liu Gang's view, different from the comprehensive replacement of foreign products in the field of national defense and military affairs, China's chip technology is deliberately suppressed in the civil market. In fact, it can compete with each other in terms of technology, but it is not well-known. Many enterprises do not know how to use performance and follow-up development, which leads to sales failure and cost reduction. Moreover, in the current IC industry chain, there is still a big gap in the manufacturing level compared with foreign countries. In addition, compared with foreign integrated circuit industry, China still has disadvantages such as small scale and scattered strength.

Ye Tianchun believes that China's IC industry has entered a new stage from catching up to originality, and more attention should be paid to innovation, especially original innovation and integrated innovation. The practice of CETC may have reference significance, that is, with the help of social resources, it will join an industry's whole machine, become a partner, make a successful example, and then push out chips. "During the 13th Five Year Plan period, we will continue to develop" Huarui 3 "to form a series Liu Gang said that the next development and application focuses on communication infrastructure, industrial control, automotive electronics, instrumentation, satellite navigation, transportation, medical electronics and other fields.

It is understood that the Ministry of industry and information technology, the national development and Reform Commission and other relevant departments are expected to launch an action plan for the development of integrated circuit products and technologies applied to mobile intelligent terminals, network communications, cloud computing, Internet of things and other fields this year. Beijing, Tianjin, Xiamen and other places have also formulated the outline of IC industry development plan and established relevant industry funds. In addition, China's high-end chip alliance, which is composed of 27 enterprises, has recently been officially established to seek in-depth integration of industry, University, research and application, and to create an industrial ecology of "architecture chip software whole machine system information service".

"All parties focus on firepower. In the next three to five years, China's integrated circuit manufacturing level is expected to level with that of foreign countries." Liu Gang predicted that the internal integration speed of the chip industry is accelerating, and in the next period of time, the chip industry will face a major reshuffle.

At present, China's LED industry has to accelerate the integration of its core industry and securities industry. The first stage is to promote the integration of China's semiconductor industry and the securities industry.

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